Technical Leadership for Advanced Packaging Quality and Reliability
Building Technical Leadership Skills for the Semiconductor Industry
A focused three-day learning journey that will advance participants' technical expertise and capacity for leading and evaluating quality and reliability initiatives in advanced packaging operations.
Program Overview
November 2 - 4, 2026
The University of Arizona Scottsdale Center
Scottsdale, Arizona
Cost: $3,000
University of Arizona Alumni discounts available
Click here to download the program flyer to learn more about the program's schedule and faculty!
Program details, agenda, and faculty are subject to change.
Why Attend the Technical Leadership for Advanced Packaging Quality and Reliability Program?
- Expertise from a Top Business School: The program is offered through the University of Arizona Eller College of Management, a top-ranked institution recognized for excellence in executive education.
- Tailored for the Semiconductor Sector: The curriculum is specifically designed for engineering and business professionals in the semiconductor sector.
- Learn from Seasoned Industry Experts: Our instructors are executive and technical leaders with over three decades in semiconductor product development, yield, quality, and reliability.
- Networking Opportunities: Gain fresh ideas and perspectives by connecting with peers. Join the ranks of alumni of Eller Executive Education programs.
- Customized Content: Through strategic partnerships with stakeholders in the semiconductor sector, this program is designed to meet the evolving needs of the advanced packaging sector.
Who Should Attend?
This program is designed for engineering and business professionals, directors, senior managers, and others engaged in ensuring product quality and reliability in advanced packaging operations.
Our distinctive program provides valuable insights into the challenges and opportunities leaders face in addressing quality and reliability over the product life cycle.
What Will You Learn?
The Technical Leadership for Advanced Packaging Quality and Reliability program offers a dynamic, hands-on curriculum tailored to address the most relevant technical leadership issues impacting advanced packaging operations. Delivered in a modular format over three days, the program allows participants to build skills progressively while engaging directly with their peers and seasoned industry experts.
Core program modules include:
- Packaging Baselines and Industry Trends
- Quality and Reliability Metrics
- Quality Assessment Methodologies
- Reliability Evaluation Methodologies
- Advanced Concepts
I loved not just the course content and the instructor experience but the ability to learn from other attendees and gain insights from their diverse experiences. Despite my fear of public speaking, I'm more than capable of leading a room or team to success.
Kate Hutchinson
Register Today!
Are you ready to level up your technical leadership skills for advanced packaging?
Register today and be on the lookout for all the exciting details! If you have questions or would like to learn more about a custom technical leadership program, please contact SB Knobel at sbknobel@arizona.edu.